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THE EFFECTS OF PRETREATMENT SOLUTION OF THE DIRECT BONDING SYSTEM ON THE ENAMEL SURFACE
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À念ÀÏ ( Chang Yong-Il ) - ¼¿ï´ëÇб³ Ä¡°ú´ëÇÐ Ä¡°ú±³Á¤Çб³½Ç
KMID : 0361919720030010021
Abstract
ÀúÀÚ´Â direct bonding systemÀÇ pretreatment¾× ó¸®ÈÄ Epoxy adhesiveÀÇ bonding strengthÀÇ º¯È¸¦ ÃøÁ¤Çϱâ À§Çؼ ¹ß°ÅµÈ »ó¾Ç ÀüÄ¡ Áø¸é ¹ý¶ûÁú Ç¥¸é¿¡ pretreatment¾×À¸·Î¼ 65% phosphoric acid¸¦ µµÆ÷ÇÑ ½ÇÇ豺°ú µµÆ÷ÇÏÁö ¾ÊÀº ºñ±³±ºÀ» ºñ±³¿¬±¸ÇÏ°í ÀÓ»ó¿¡ Àû¿ëÇÏ¿© ´ÙÀ½°ú °°Àº °á°ú¸¦ ¾ò¾ú´Ù. 1. ¹ý¶ûÁú Ç¥¸é¿¡ pumicing°ú 65% phosphoric acid¸¦ µµÆ÷ÇßÀ»¶§ joint strength´Â ÇöÀúÈ÷ »ó½ÂÇß´Ù. 2. Epoxy adhesiveÀÇ bonding strength´Â plastic attachment¸¦ Ä¡¾Æ¸é¿¡ Á¢ÂøÀ¯Áö½ÃÅ°±â¿¡ ÃæºÐÇϸç ÀÓ»óÀûÀ¸·Î ÀÌ¿ëÇÒ ¼ö ÀÖ´Ù. 3. Joint area°¡ Ŭ ¼ö·Ï bonding strength´Â Áõ°¡Çß´Ù.
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